808-AG11D-LF TE Connectivity
Артикул
808-AG11D-LF
Бренд
TE Connectivity
Описание
CONN IC DIP SOCKET 8POS GOLD, 8 (2 x 4) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
Цена
305 руб.
Теги
Connectors, Interconnects, Разъемы, соединители, Sockets for ICs, Transistors, Гнезда для микросхем, транзисторов
Image
files/808-AG11D-LF.jpg
Other Names
A126550,-808-AG11D-LF-SI,-808-AG11D-LF-SI-ND,2-1571586-2-ND,-2-1571586-2-SI,2-1571586-2
Material Flammability Rating
UL94 V-0
Termination
Solder
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
25.0µin (0.63µm)
Number of Positions or Pins (Grid)
8 (2 x 4)
Pitch - Mating
0.100" (2.54mm)
Contact Material - Mating
Beryllium Copper
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Gold
Contact Finish Thickness - Post
25.0µin (0.63µm)
Contact Material - Post
Copper
Termination Post Length
0.125" (3.18mm)
Type
DIP, 0.3" (7.62mm) Row Spacing
Standard Package
60
Series
800
Package
Tube
Part Status
Obsolete
Mounting Type
Through Hole
Features
Open Frame
Operating Temperature
-55°C ~ 105°C
Housing Material
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Base Product Number
808
RoHS Status
RoHS Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Affected
ECCN
EAR99
HTSUS
8536.69.4040
Contact Resistance
10mOhm
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